Product Engineer – Mask Release & Design Automation

Accountabilities The Product Engineer – Mask Release & Design Automation will support semiconductor design operations by managing photomask release activities, improving automation workflows, and ensuring smooth coordination across engineering teams. The role requires technical expertise in semiconductor processes, strong problem-solving abilities, and a focus on process efficiency. Execute photomask (reticle) release activities to support semiconductor tape-out schedules and production milestones. Prepare, review, and validate reticle orders before submission to external mask manufacturing partners. Develop, maintain, and improve Python-based automation tools for chip assembly and mask release workflows. Collaborate with design, process, and manufacturing teams to coordinate accurate and timely reticle deliveries. Review semiconductor layouts and MEBES data to ensure quality, manufacturability, and compliance with requirements. Troubleshoot layout, automation, infrastructure, and workflow issues in partnership with engineering teams. Maintain detailed documentation, process records, and traceability throughout tape-out activities. Identify opportunities to streamline engineering processes through automation and technical improvements. Requirements: The ideal candidate is a semiconductor engineer with experience in physical design, mask release processes, and engineering automation. This role requires a strong technical foundation, programming knowledge, and the ability to collaborate effectively with multidisciplinary teams. Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Semiconductor Engineering, or a related technical field. 2+ years of experience in semiconductor design, mask release, tape-out operations, or design automation. Strong knowledge of Linux operating systems and Unix/Linux shell scripting. Proficiency in Python programming and experience developing automation solutions. Experience with semiconductor EDA tools such as Synopsys ICVWB, Cadence Virtuoso, or similar platforms. Understanding of semiconductor physical layouts, design rules, and fabrication processes. Strong analytical, troubleshooting, and problem-solving skills. Excellent communication and collaboration abilities when working with engineering teams. Experience with lithography, photomask manufacturing processes, OPC, reticle frame building, or MEBES data is preferred. Must be a U.S. Citizen or Green Card holder. Benefits: Competitive hourly compensation ranging from $50 to $60 USD/hour, based on experience, skills, education, and market factors. Fully remote contract opportunity available across the United States. Ongoing contract engagement supporting advanced semiconductor engineering initiatives. Opportunity to work on next-generation chip development and automation projects. Exposure to cutting-edge semiconductor design, manufacturing, and process technologies. Collaborative environment with experienced engineering professionals. Competitive benefits package available depending on eligibility and contract terms.